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Game board method
Filed: March 12th, 1986 [Granted]
Patent Number: 4651996
... [54] GAME BOARD METHOD [76] Inventor: Ray R. Watkins, Jr., RR 1, Newton, 111 . 62448 [21] Appl. No.: 838699 [22] Filed: Mar. 12, 1986 [51] Int. Cl.< A63F ...
Bamboo fiber board method
Filed: April 11th, 2003 [Granted]
Assignee: Japan Blower Ind Co Ltd
Patent Number: 6689298
... BOARD METHOD (75) Inventor: Seiji Yoshida, Osaka (JP) (73) Assignee: Japan Blower Ind. Co., Ltd., Osaka (JP) ( * ) Notice: Subject to any disclaimer, ...
Printed circuit board method and apparatus
Filed: May 27th, 2003 [Pending]
Assignee: Samsung Electronics Co Ltd
Patent Application Number: 10444989
Date: Apr. 15, 2004 (54) PRINTED CIRCUIT BOARD METHOD AND (30) Foreign Application Priority Data APPARATUS Oct. 15, 2002 (KR) 2002-62904 (75) Inventors : ...
ANTI-DEFLECTION DRAIN BOARD METHOD AND APPARATUS
Filed: May 26th, 1967 [Granted]
Assignee: Beloit Corporation
Patent Number: 3585105
June 15, 1971 LM STUEBE 3585105 . ANTI-DEFLECTION DRAIN BOARD METHOD AND APPARATUS Filed May 26, 1967 2 Sheets-Sheet 1 ...
Circuit board, method of producing same, and power module
Filed: April 21st, 2003 [Granted]
Assignee: Mitsubishi Materials Corporation
Patent Number: 7128979
(45) Date of Patent: US 7128979 B2 Oct. 31, 2006 (54) CIRCUIT BOARD, METHOD OF PRODUCING SAME, AND POWER MODULE (75) Inventors: Toshiyuki Nagase, ...
WIRING BOARD, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE
Filed: November 17th, 2005 [Pending]
Assignee: MATSUSHITA ELECTRIC INDUSTRIAL CO LTD
Patent Application Number: 11719313
Date: May 28, 2009 (54) WIRING BOARD, METHOD FOR MANUFACTURING SAME AND SEMICONDUCTOR DEVICE (75) Inventor: (21) (22) (86) Hideki Higashitani, ...
Interlayer connection structure of multilayer wiring board, method of ...
Filed: August 20th, 2002 [Granted]
Assignee: Fujikura Ltd
Patent Number: 6921869
1 INTERLAYER CONNECTION STRUCTURE OF MULTILAYER WIRING BOARD, METHOD OF MANUFACTURING METHOD OF FORMING LAND THEREOF CROSS-REFERENCE TO RELATED APPLICATIONS ...
Wiring board, method for manufacturing a wiring board and electronic equipment
Filed: April 1st, 2004 [Pending]
Assignee: Matsushita Electric Industrial Co Ltd
Patent Application Number: 10816485
The wiring board according to claim 1, wherein the conductive layers and the insulation layers are formed by at least one of a vapor deposition method, ...
