Direct bond 5 patents | Patentfish.com

(Benzimidazolyl- and imidazopyridinyl) containing 1-(1,2-disubstituted ...

Filed: June 19th, 1998 [Granted]

Patent Number: 6110939

CH3 direct bond (±)- trans / \_J^_ 49 B3a NH 3?5-bis-trifluoro- direct bond (±)- trans methyl)phenyl 50 B4 direct bond 6-benzothiazolyl direct bond ...

Aminotetralin-derived urea modulators of vanilloid VR1 receptor

Filed: May 15th, 2003 [Pending]

Patent Application Number: 10438477

... m is 1, L is a direct bond, R3 is 5-isoquinolinyl, and X is O; a compound of formula (la) wherein Rx is 6-OMe, R2 is Ph, m is 1, L is a direct bond, ...

Enhanced direct bond structure

Filed: December 21st, 1989 [Granted]

Assignee: General Electric Company

Patent Number: 4996116

Another object of the present invention is to provide 5 improved wetting between a copper-copper oxide eutectic and a substrate to provide an improved bond ...

Direct positive silver halide photographic material and method for forming ...

Filed: August 18th, 1993 [Granted]

Assignee: Dainippon Ink and Chemicals Inc

Patent Number: 5362621

... of a nitrogen-containing compound in which a quinoline nucleus or an isoquino- 65 line nucleus is bonded to a pyridinium nucleus via a direct bond. 5 .

Water-soluble compounds having a fiber-reactive group of the vinyl sulfone ...

Filed: October 22nd, 1992 [Granted]

Assignee: Hoechst Aktiengesellschaft

Patent Number: 5292871

... A is phenylene or a direct bond; W is different from A and is a direct bond or an ... direct bond vinyl yellow napbth-2-yl amino (395) 57 1,5-disulfo- ...

Method of making circuit assembly with hardened direct bond lead frame

Filed: November 13th, 1987 [Granted]

Assignee: Gentron Corporation

Patent Number: 4788765

4788765 METHOD OF MAKING CIRCUIT ASSEMBLY WITH HARDENED DIRECT BOND LEAD FRAME BACKGROUND AND SUMMARY 5 The invention relates to electric circuit assemblies ...

Thianaphthene derivatives

Filed: January 27th, 1987 [Granted]

Assignee: Sankyo Company Limited

Patent Number: 4847272

W Direct bond — CH2— =CH— — CH=CH— — CH2— CH2— Direct bond Direct bond — CH2— = CH— ... Y— Z 2-1 2-2 2-3 2-4 2-5 2-6 2-7 2-8 2-9 TABLE 2 Rl R2 ImidMe ImidMe ...

Direct bond circuit assembly with crimped lead frame

Filed: March 24th, 1989 [Granted]

Patent Number: 4924292

4924292 DIRECT BOND CIRCUIT ASSEMBLY WITH CRIMPED LEAD FRAME This is a division of application Ser. No. 07/180541, 5 filed Apr. 12, 1988.