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Electric soldering iron having solder holding means
Filed: November 22nd, 1993 [Granted]
Patent Number: 5482199
United States Patent [19] Walker [54] ELECTRIC SOLDERING IRON HAVING SOLDER HOLDING MEANS [76] Inventor: Leroy Walker, 4719 Rhodes Dr., New Orleans, La.
Circuit board having solder bumps
Filed: March 28th, 1997 [Granted]
Assignee: NGK Spark Plug Co Ltd
Patent Number: 6660944
4A and 15 having been 21 fim in coplanarity were flattened as shown in FIG. 4B, so that a circuit board 33 having solder bumps 31 whose coplanarity was 10 ...
Electrical contacts having solder stops
Filed: December 1st, 2006 [Granted]
Assignee: Samtec Inc
Patent Number: 7377795
(45) Date of Patent: US 7377795 B2 May 27, 2008 ELECTRICAL CONTACTS HAVING SOLDER STOPS Inventors: Brian Vicich, Prospect, KY (US); Steve Koopman, ...
Semiconductor chip having solder bump
Filed: February 13th, 2006 [Pending]
Patent Application Number: 11352352
17, 2006 (54) SEMICONDUCTOR CHIP HAVING SOLDER BUMP (75) Inventor: Hidenobu Takahira, Kurokawa-gun (JP) Correspondence Address: BIRCH STEWART KOLASCH ...
Method of soldering electronic component having solder bumps to substrate
Filed: June 22nd, 2005 [Granted]
Assignee: Panasonic Corporation
Patent Number: 7568610
4, 2009 (54) METHOD OF SOLDERING ELECTRONIC COMPONENT HAVING SOLDER BUMPS TO SUBSTRATE (75) Inventors: Tadahiko Sakai, Fukuoka (JP); Tadashi Maeda, ...
WIRING BOARD HAVING SOLDER BUMP AND METHOD FOR MANUFACTURING THE SAME
Filed: March 17th, 2009 [Pending]
Patent Application Number: 12405536
Field of the Invention [0003] The present invention relates to a wiring board having solder bumps therein and to a method for manufacturing the same.
Support assembly for an integrated circuit package having solder columns
Filed: July 23rd, 2002 [Pending]
Patent Application Number: 10202416
... AN INTEGRATED CIRCUIT PACKAGE HAVING SOLDER COLUMNS FIELD OF THE INVENTION [ 0001] The present invention relates to circuit components mounted on circuit ...
Electronic component having solder ball retaining terminal
Filed: April 1st, 2002 [Granted]
Patent Number: 6755667
(54) ELECTRONIC COMPONENT HAVING SOLDER BALL RETAINING TERMINAL (76) Inventor: Chien-Chung Lin, 3F, No. 3, Lane 32, Kuo Feng Chi St., Tao Yuan City (TW) ...
