Incep technologies inc patents

Integrated power delivery and cooling system for high power microprocessors

Filed: November 8th, 2002 [Granted]

Patent Number: 6801431

IIIH US006801431B2 (12) United States Patent ao) Patent No.: us 6801431 B2 Hartke et al. (45) Date of Patent: Oct. 5, ...

Method and apparatus for providing power to a microprocessor with integrated ...

Filed: July 23rd, 2002 [Pending]

Assignee: INCEP Technologies Inc

Patent Application Number: 10201384

(19) United States (12) Patent Application Publication (io) Pub. No.: US 2002/ 0196614 Al DiBene, II et al. (43) Pub. Date: Dec.

Ultra-low impedance power interconnection system for electronic packages

Filed: December 20th, 2001 [Granted]

Assignee: INCEP Technologies Inc

Patent Number: 6847529

IIIH US006847529B2 (12) United States Patent (io) Patent No.: US 6847529 B2 Dibene, II et al. (45) Date of Patent: Jan.

Integrated power delivery with flex circuit interconnection for high density ...

Filed: December 4th, 2001 [Granted]

Assignee: Incep Technologies Inc

Patent Number: 6741480

Illlllllllllllllllllllllllllllllllllllllllllllllll US006741480B2 (12) United States Patent ao) Patent No.: us 6741480 B2 Hartke et al.

Method and apparatus for thermal and mechanical management of a power ...

Filed: March 8th, 2001 [Granted]

Assignee: INCEP Technologies Inc

Patent Number: 6452804

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII US006452804B1 (12) United States Patent ao) Patent No.: us 6452804 bi Dibene, II et al.

Method and apparatus for providing power to a microprocessor with integrated ...

Filed: May 16th, 2002 [Pending]

Assignee: INCEP Technologies Inc

Patent Application Number: 10147138

Illllllllllllllllllllllllllllllllllllllllllllllllll (19) United States (12) Patent Application Publication (io) Pub. No.: US 2002/0172022 Al DiBene, ...

Apparatus for providing power to a microprocessor with integrated thermal ...

Filed: February 16th, 2001 [Granted]

Assignee: INCEP Technologies Inc

Patent Number: 6452113

Illllllllllllllllllllllllllllllllllllllllllllllll US006452113B2 (12) United States Patent ao) Patent No.: us 6452113 B2 Dibene, II et al.

Vortex heatsink for high performance thermal applications

Filed: May 17th, 2002 [Granted]

Assignee: Incep Technologies Inc

Patent Number: 6698511

IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII US006698511B2 (12) United States Patent ao) Patent No.: us 6698511 B2 DiBene, II et al.