Integrated business process modeling environment and models created thereby
Filed: October 31st, 2001 [Pending]
Patent Application Number: 9984977
[0056] By selecting the partitioning tab of display 200 in FIG. ... eg a .jar file, deployment descriptors, and any other files needed for deployment.
Systems and methods for managing integrated systems with use cases
Filed: July 30th, 2008 [Granted]
Patent Number: 7886048
This provides a network file share repository for all collateral shared ... 10E shows the setup details including default values in the Voice Messaging tab.
Tape carrier for TAB, integrated circuit device, a method of making the same ...
Filed: May 21st, 1998 [Granted]
Patent Number: 6084291
Field of the Invention The invention relates to a tape carrier for TAB for mounting an integrated circuit component, an integrated circuit device packaged ...
Packaging system for stacking integrated circuits
Filed: April 15th, 1988 [Granted]
Patent Number: 4953005
The number of fingers 166 that comprise the interconnection pattern of the TAB film 140 corresponds to the number of bonding pads of the integrated circuit ...
Combined flat capacitor and tab integrated circuit chip and method
Filed: June 18th, 1990 [Granted]
Patent Number: 5049979
11-14, a specific method is shown of attaching 10 a capacitor 12 to an integrated circuit chip 14 by the use of tape-automated-bonding (TAB) tape.
Cooling cap method and apparatus for tab packaged integrated circuits
Filed: February 22nd, 1996 [Granted]
Patent Number: 5805418
1 COOLING CAP METHOD AND APPARATUS FOR TAB PACKAGED INTEGRATED CIRCUITS STATEMENT REGARDING GOVERNMENT 5 FIGHTS The present invention was made with ...
Ultrasound probe with integrated electronics
Filed: March 11th, 2003 [Pending]
Patent Application Number: 10386360
[0412] The Explorer window provides the nested level file directory for all ... The user clicks on the Image Display tab to view the ultrasound image.
Semiconductor device and fabrication method which advantageously combine ...
Filed: October 22nd, 1997 [Granted]
Patent Number: 5973397
1 SEMICONDUCTOR DEVICE AND FABRICATION METHOD WHICH ADVANTAGEOUSLY COMBINE WIRE BONDING AND TAB TECHNIQUES TO INCREASE INTEGRATED CIRCUIT I/O PAD 5 DENSITY ...