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Heat-developable recording material
Filed: October 16th, 2001 [Granted]
Assignee: Fuji Photo Film Co Ltd
Patent Number: 6413705
Regarding this technique, Japanese Patent Laid Open No. ... 883022A1, International Patent Laid-Open No. 36322/1998, 25 Japanese Patent Laid-Open No.
PROCESS FOR PRODUCING THERMOPLASTIC RESIN FILM
Filed: September 24th, 2009 [Pending]
Assignee: FUJIFILM CORPORATION
Patent Application Number: 12566002
2002- 167694, Japanese Patent Application Laid-Open No. 2000-302988, Japanese Patent Application Laid-Open No. 2007-113110, Japanese Patent Application ...
Negative-working resist composition for electron beams or x-rays
Filed: March 20th, 2002 [Granted]
Assignee: Fuji Photo Film Co Ltd
Patent Number: 6887647
150848/1990 and Japanese Patent Laid- 55 Open No. ... 291260/1992, 2 Japanese Patent Laid-Open No. 291261/1992, and Japanese Patent Laid-Open No.
Carbostyril derivative
Filed: August 13th, 1992 [Granted]
Assignee: Otsuka Pharmaceutical Co Ltd
Patent Number: 5227381
(1979) (oxyindole type compounds), Japanese Patent Kokai (Laid-Open) No. 57- 14578 (1982) (ben- zimidazole-2-one type compounds), Japanese Patent Kokai ...
Industrial Process for Production of High-Purity Diaryl Carbonate
Filed: October 17th, 2005 [Pending]
Patent Application Number: 11661611
4-224547; Patent Document 6: Japanese Patent Application Laid-Open No. 4-230242; Patent Document 7: Japanese Patent Application Laid-Open No. 4-235951).
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Filed: March 19th, 2010 [Pending]
Assignee: RENESAS TECHNOLOGY CORP
Patent Application Number: 12727337
[0003] Japanese Patent Laid-Open No. 2004-247559 (Patent Document 1) and US Patent Publication No. 2007- 0148896 (Patent Document 2) disclose a technology ...
HEAT-DEVELOPABLE RECORDING MATERIAL
Filed: October 16th, 2001 [Pending]
Patent Application Number: 9977373
Concerning these matters, detailed descriptions are found in International Patent Laid-Open No. 36322/1998, Japanese Patent Laid-Open No.
Lubricating oil containing a polyvinyl ether compound for compression-type ...
Filed: December 9th, 1994 [Granted]
Assignee: Idemitsu Kosan Co Ltd
Patent Number: 5518643
For example, Research Disclosure No. 17463 (October, 1978), the specification of the US Pat. No. 4755316, Japanese Patent Application Laid Open No.
