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Single die stitch bonding
Filed: July 31st, 2002 [Granted]
Assignee: Microchip Technology Inc
Patent Number: 7157790
4, depicted is a plan view of an 5 integrated circuit die having two bond pads and an inner lead of a leadframe connected together with a single stitch bond ...
Connecting a Plurality of Bond Pads and/or Inner Leads With a Single Bond Wire
Filed: November 28th, 2006 [Pending]
Patent Application Number: 11563803
A single bond wire 410a connects bond pad 104a, inner lead 106a and inner lead 1066 together and requires only one bond point a each connection area of the ...
Heterocyclic compounds having tachykinin receptor antagonist activity their ...
Filed: December 2nd, 1996 [Granted]
Assignee: Sankyo Company Limited
Patent Number: 6159967
... Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single Bond Single ...
Remedies or preventives for urinary frequency or urinary incontinence and ...
Filed: October 8th, 2003 [Pending]
Assignee: Toray Industries Inc
Patent Application Number: 10530664
... R1 R2 R3 3-4 bond R4 CPM OH OH single bond (non-substituted) CPM OH OH single bond 3-methylene CPM OH OH single bond 3-ethylidene CPM OH OH single bond ...
Substituted pyrrolo[3,2-d]pyrimidines as glycogen synthase kinase (GSK ...
Filed: February 24th, 2003 [Granted]
Assignee: Teijin Limited
Patent Number: 7528140
-A1- -A2- -G'-A^A-'-G2 -A5-R2 X 1-0353 — (CH2)2— single bond K14 J22 s 40 1-0417 ... single bond K14 J28 o 1-0418 — (CH2)2— single bond K525 J4 o 1-0355 ...
Novel anilide compounds and pharmaceutical compositions comprising them
Filed: February 21st, 2001 [Pending]
Patent Application Number: 9789967
... R5 1 0 S single 0 2-iPr H 6-iPr HH bond 2 0 S single 1 2-iPr H 6-iPr HH bond 3 0 s single 2 2-iPr H 6-iPr HH bond 4 0 s single 3 2-iPr H 6-iPr HH bond 5 ...
Novel single-bond carbon film and process for the production thereof
Filed: October 13th, 1988 [Granted]
Assignee: Canon Kabushiki Kaisha
Patent Number: 4932331
Following the above-mentioned procedures and carrying out the fum-forming process for 3 hours, there were prepared a plurality of single-bond carbon film 35 ...
Deriving fixed bond information
Filed: February 18th, 2000 [Granted]
Assignee: CambridgeSoft Corporation
Patent Number: 7295931
All possible ESVDs may be attempted for all atoms, and all bond orders ( including single and double) may be 5 attempted for all bonds.
